S.Amdt. 2366Senate118th Congress (2023-2025)
S.Amdt. 2366
Sponsored by
Sen. Mark Kelly (D-AZ)
Submitted July 11, 2024
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Senate amendment submitted
July 11, 2024
Text
Submitted
SA 2366. Mr. KELLY (for himself and Mrs. Blackburn) submitted an amendment intended to be proposed by him to the bill S. 4638, to authorize appropriations for fiscal year 2025 for military activities of the Department of Defense, for military construction, and for defense activities of the Department of Energy, to prescribe military personnel strengths for such fiscal year, and for other purposes; which was ordered to lie on the table; as follows: At the end of subtitle H of title X, add the following: SEC. 1095. CHIP EQUIP ACT. (a) Short Title.--This section may be cited as the ``The Chip Equipment Quality, Usefulness, and Integrity Protection Act of 2024'' or the ``Chip EQUIP Act''. (b) Purchases of Semiconductor Manufacturing Equipment.-- (1) Definitions.--Section 9901 of the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021 (15 U.S.C. 4651) is amended by inserting after paragraph (13) the following: ``(14) The term `completed, fully assembled' means the state in which all (or substantially all) necessary parts, chambers, subsystems, and subcomponents have been put together, resulting in a ready-to-use or ready-to-install item to be directly purchased from an entity. ``(15) The term `ineligible equipment'-- ``(A) means completed, fully assembled semiconductor manufacturing equipment that is manufactured or assembled by a foreign entity of concern or subsidiary of a foreign entity of concern and used in the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors; ``(B) includes-- ``(i) deposition equipment; ``(ii) etching equipment; ``(iii) lithography equipment; ``(iv) inspection and measuring equipment; ``(v) wafer slicing equipment; ``(vi) wafer dicing equipment; ``(vii) wire bonders; ``(viii) ion implantation equipment; ``(ix) chemical mechanical polishing; and ``(x) diffusion or oxidation furnaces; and ``(C) does not include any part, chamber, subsystem, or subcomponent that enables or is incorporated into such equipment.''. (2) Ineligible use of funds.--Section 9902 of the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021 (15 U.S.C. 4652) is amended by adding at the end the following: ``(j) Ineligible Use of Funds.-- ``(1) In general.--Subject to paragraph (2), the Secretary shall include in the terms of each agreement with a covered entity for the award of Federal financial assistance under this section prohibitions with respect to a project relating to the procurement, installation, or use of ineligible equipment, to be effective for the duration of the agreement. ``(2) Waiver.--The Secretary may waive the prohibitions described in paragraph (1) if-- ``(A) the ineligible equipment to be purchased by the applicable covered entity is not produced in the United States or an allied or partner country in sufficient and reasonably available quantities or of a satisfactory quality to support established or expected production capabilities; or [[Page S4708]] ``(B)(i) the use of the ineligible equipment complies with the requirements set forth in the Export Administration Regulations, as defined in section 1742 of the Export Control Reform Act of 2018 (50 U.S.C. 4801); and ``(ii) the Secretary, in consultation with the Director of National Intelligence or the Secretary of Defense, determines the waiver is in the national security interest of the United States. ``(3) Foreign entities of concern.--Nothing in this subsection shall be construed to waive the application of section 9907.''. ______