S.Amdt. 6390Senate119th Congress (2025-2027)
S.Amdt. 6390
Sponsored by
Sen. Catherine Cortez Masto (D-NV)
Submitted June 24, 2026
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Senate amendment submitted
June 24, 2026
Text
Submitted
SA 6390. Ms. CORTEZ MASTO submitted an amendment intended to be proposed by her to the bill S. 4784, to authorize appropriations for fiscal year 2027 for military activities of the Department of Defense, for military construction, and for defense activities of the Department of Energy, to prescribe military personnel strengths for such fiscal year, and for other purposes; which was ordered to lie on the table; as follows: In section 1248, strike subsection (c) and insert the following (a) Covered AI Chip Defined.--In this section, the term ``covered AI chip'' means any advanced integrated circuit, computer, or other product that-- (1)(A) is designed by or manufactured using technology originating in the United States, including items produced abroad using intellectual property, design software, or semiconductor manufacturing equipment originating in the United States; and (B)(i) is classified or classifiable under Export Control Classification Number 3A090, 4A090, 5A002.z, related .z Export Control Classification Numbers, or any successor classification; or (ii) is an item that is functionally equivalent to an item classified or classifiable as described in clause (i); (2) an integrated circuit, computer, or other product that is-- (A) classified under Export Control Classification Number 3A090 or 4A090 or related Export Control Classification Numbers; or (B) functionally equivalent or substantially similar to a circuit, computer, or product described in subparagraph (A); or (3) an integrated circuit that has one or more digital processing units with-- (A) a total processing performance of 4,800 or more; (B) a total processing performance of 2,400 or more and a performance density of 1.6 or more; (C) a total processing performance of 1,600 or more and a performance density of 3.2 or more; or (D) a total DRAM bandwidth of 1,400 gigabytes per second or more, interconnect bandwidth of 1,100 gigabytes per second or more, or a sum of DRAM bandwidth and interconnect bandwidth of 1,700 gigabytes per second or more. ______